TSP Equipment Solution-FPCB Bond
TSP Equipment Solution-FPCB Bond

FPCB Bond.jpg

 

 

 

 Item    Specifications  
 Glass (TSP) Size    ~ 5.5”  
 Head & Stage    4Head & 4Stage  
 FPCB Bonding Accuracy    ±50㎛  
 Alignment    Manual Alignment (CCD Camera)  
  Tact Time    12.0 sec (包含Loading & Unloading) 
 Air Supply    5.0~7.0Kg/㎠  
 Power Supply    AC 220 v,50~60Hz  
 Dimensions    1,700(L)×800(W)×1,800(H)