TSP Equipment Solution-Auto Bonder
TSP Equipment Solution-Auto Bonder

Auto Bonder.jpg

 Item    Specifications  
 适用产品大小    ~ 5.5”  
 Head    ACF 2 / Pre 1 / Main4 Head  
 FPCB Bonding Accuracy    ±30㎛  
 Alignment    Vision Auto Alignment  
  Tact Time    7.0 sec  
 Air Supply    5.0~7.0Kg/㎠  
 Power Supply    AC 220 v,50~60Hz  
 Dimensions    2,900(L)×1,100(W)×1,800(H)   (除外Loader & unloader)